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Brian Corbett

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2 publications

preprint2020arXiv

Micro-transfer printing high-efficiency GaAs photovoltaic cells onto silicon for wireless power applications

Here we report the development of high-efficiency microscale GaAs laser power converters, and their successful transfer printing onto silicon substrates, presenting a unique, high power, low-cost and integrated power supply solution for implantable electronics, autonomous systems and internet of things applications. We present 300 μm diameter single-junction GaAs laser power converters and successfully demonstrate the transfer printing of these devices to silicon using a PDMS stamp, achieving optical power conversion efficiencies of 48% and 49% under 35 and 71 W/cm2 808 nm laser illumination respectively. The transferred devices are coated with ITO to increase current spreading and are shown to be capable of handling very high short-circuit current densities up to 70 A/cm2 under 141 W/cm2 illumination intensity (~1400 Suns), while their open circuit voltage reaches 1235 mV, exceeding the values of pre-transfer devices indicating the presence of photon-recycling. These optical power sources could deliver Watts of power to sensors and systems in locations where wired power is not an option, while using a massively parallel, scalable, and low-cost fabrication method for the integration of dissimilar materials and devices.

preprint2019arXiv

CMOS-compatible titanium nitride for on-chip plasmonic Schottky photodetector

Here, we propose titanium nitride (TiN) as an alternative plasmonic material for an on-chip silicon plasmonic Schottky photodetector that is based on an internal photoemission process and operating at telecom wavelengths. The examined structure employs an asymmetric metal-semiconductor-metal waveguide structure with one of the electrodes being gold and the second either gold, titanium or titanium nitride. Apart from the excellent optical properties desired for this type of photodetector such as high absorption losses and reasonably high real part of the permittivity, titanium nitride is a CMOS-compatible material that enables easy integration with existing CMOS technology. For the first time, we find a Schottky barrier height of 0.67 eV for titanium nitride on p-doped silicon, which is very close to the optimal value of 0.69 eV. This value ensures very high signal-to-noise ratio of the photodetector operating at a wavelength of 1550 nm. Additionally, TiN provides shorter penetration depth of the mode into metal compared to Ti, which enhances transmission probability of hot electrons to a semiconductor and gives rise to responsivity enhancement.

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