Abstract
This paper is about a new manufacturing process aimed at developing stable SiO2/Si3N4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret Vibration Energy Harvesters (VEH). Electrets charged by a positive corona discharge show excellent stability with high surface charge density that can reach 5mC/m^{2} on 1.1\mum-thick layers, even with fine patterning (down to 25\mum) and harsh temperature conditions (up to 250°C), paving the way to new electret VEH designs and manufacturing processes.
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