Paper detail

Magnetoresistance and surface roughness study of electrodeposited Ni50Co50/Cu multilayers

Room-temperature transport properties (the zero-field resistivity, ρ0, and the GMR) were studied for ED Ni50Co50/Cu multilayers as a function of the individual layer thicknesses and total multilayer thickness. The Cu deposition potential was optimized in order to obtain the preset layer thicknesses. The surface roughness development was studied by AFM, which revealed an exponential roughening with total thickness. The Cu layer thickness strongly influenced the roughness evolution. As expected, ρ0 decreased with increasing Cu layer thickness whereas it increased strongly for large total multilayer thicknesses that could be ascribed to the observed deposit roughening. All multilayers with Cu layer thicknesses above about 1.5 nm exhibited a GMR behavior with a maximum GMR of about 5 %. The GMR decreased for total multilayer thicknesses above about 300 nm due to the strong increase of ρ0, the latter caused by the enhanced roughness. The GMR data indicated the appearance of a current at angle to plane type scattering due to the layer undulations. The thickness evolution of the MR data was analyzed in detail after separating the ferromagnetic and superparamagnetic GMR contributions. It could be established that ED Ni-Co/Cu multilayers do not exhibit an oscillatory GMR behavior with spacer thickness.