Researcher profile

Yelong Wei

Yelong Wei contributes to research discovery and scholarly infrastructure.

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Published work

2 published item(s)

preprint2021arXiv

Design, fabrication and low-power RF measurement of an X-band dielectric-loaded accelerating structure

Dielectric-loaded accelerating (DLA) structures are being studied as an alternative to conventional disk-loaded copper structures to produce the high accelerating gradient. This paper presents the design, fabrication and low-power RF measurement of an externally-powered X-band DLA structure with a dielectric constant epsilon_r=16.66 and a loss tangent tan_delta=0.0000343. A dielectric matching section for coupling the RF power from a circular waveguide to an X-band DLA structure consists of a very compact dielectric disk with a width of 2.035 mm and a tilt angle of 60 degree, resulting in a broadband coupling at a low RF field which has the potential to survive in the high-power environment. Based on simulation studies, a prototype of the DLA structure was fabricated. Results from bench measurements and their comparison with design values are presented. The detailed analysis on the fabrication error which may cause the discrepancy between the RF measurements and simulations is also discussed.

preprint2020arXiv

A compact, low field, broadband matching section for externally-powered X-band dielectric-loaded accelerating structures

It has been technically challenging to efficiently couple external radiofrequency (RF) power to cylindrical dielectric-loaded accelerating (DLA) structures, especially when the DLA structure has a high dielectric constant. This paper presents a novel design of matching section for coupling the RF power from a circular waveguide to an X-band DLA structure with a dielectric constant epsilon_r=16.66 and a loss tangent tan_delta=0.0000343. It consists of a very compact dielectric disk with a width of 2.035 mm and a tilt angle of 60 degree, resulting in a broadband coupling at a low RF field which has the potential to survive in the high-power environment. To prevent a sharp dielectric corner break, a 45 degree chamfer is also added. A microscale vacuum gap, caused by metallic clamping between the thin coating and the outer thick copper jacket, is also studied in detail. Through optimizations, more than 99% of RF power is coupled into the DLA structure, with the maximum electromagnetic fields located at a DLA structure. Tolerance studies on the geometrical parameters and mechanical design of the full-assembly structure are also carried out as a reference for realistic fabrication.