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William Allison

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2 published item(s)

preprint2016arXiv

Energy Dissipation during Diffusion at Metal Surfaces: Disentangling the Role of Phonons vs. Electron-Hole Pairs

Helium spin echo experiments combined with ab initio-based Langevin molecular dynamics simulations are used to quantify the adsorbate-substrate coupling during the thermal diffusion of Na atoms on Cu(111). An analysis of trajectories within the local density friction approximation allows the contribution from electron-hole pair excitations to be separated from the total energy dissipation. Despite the minimal electronic friction coefficient of Na and the relatively small mass mismatch to Cu promoting efficient phononic dissipation, about $(20\pm5)\%$ of the total energy loss is attributable to electronic friction. The results suggest a significant role of electronic non-adiabaticity in the rapid thermalization generally relied upon in adiabatic diffusion theories.

preprint2014arXiv

Quantum effects in the diffusion of hydrogen on Ru(0001)

An understanding of hydrogen diffusion on metal surfaces is important, not just for its role in heterogeneous catalysis and hydrogen fuel cell technology, but also because it provides model systems where tunneling can be studied under well-defined conditions. Here we report helium spin-echo measurements of the atomic-scale motion of hydrogen on the Ru(0001) surface between 75 and 250 K. Quantum effects are evident at temperatures as high as 200 K, while below 120 K we observe a tunneling-dominated temperature independent jump rate of 1.9$\times$10$^9$ s$^{-1}$, many orders of magnitude faster than previously seen. Quantum transition state theory calculations based on ab initio path-integral simulations reproduce the temperature dependence of the rate at higher temperatures and predict a crossover to tunneling-dominated diffusion at low temperatures, although the tunneling rate is under-estimated, highlighting the need for future experimental and theoretical studies of hydrogen diffusion on well-defined surfaces.