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Shaofan Li

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Computational Engineering, Finance, and Science Computer Vision cond-mat.mtrl-sci physics.class-ph physics.comp-ph

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preprint2022arXiv

On Nonlocal Cohesive Continuum Mechanics and Cohesive Peridynamic Modeling (CPDM) of Inelastic Fracture

In this work, we developed a bond-based cohesive peridynamics model (CPDM) and apply it to simulate inelastic fracture by using the meso-scale Xu-Needleman cohesive potential . By doing so, we have successfully developed a bond-based cohesive continuum mechanics model with intrinsic stress/strain measures as well as consistent and built-in macro-scale constitutive relations. The main novelties of this work are: (1) We have shown that the cohesive stress of the proposed nonlocal cohesive continuum mechanics model is exactly the same as the nonlocal peridynamic stress; (2) For the first time, we have applied an irreversible built-in cohesive stress-strain relation in a bond-based cohesive peridynamics to model inelastic material behaviors without prescribing phenomenological plasticity stress-strain relations; (3) The cohesive bond force possesses both axial and tangential components, and they contribute a nonlinear constitutive relation with variable Poisson's ratios; (4) The bond-based cohesive constitutive model is consistent with the cohesive fracture criterion, and (5) We have shown that the proposed method is able to model inelastic fracture and simulate ductile fracture of small scale yielding in the nonlocal cohesive continua. Several numerical examples have been presented to be compared with the finite element based continuum cohesive zone model, which shows that the proposed approach is a simple, efficient and effective method to model inelastic fracture in the nonlocal cohesive media.

preprint2022arXiv

Peridynamic stress is the static first Piola-Kirchhoff Virial stress

The peridynamic stress formula proposed by Lehoucq and Silling [1, 2] is cumbersome to be implemented in numerical computations. Here, we show that the peridynamic stress tensor has the exact mathematical expression as that of the first Piola-Kirchhoff static Virial stress originated from Irving-Kirkwood-Noll formalism [3, 4] through the Hardy-Murdoch procedure [5, 6], which offers a simple and clear expression for numerical calculations of peridynamic stress. Several numerical verifications have been carried out to validate the accuracy of proposed peridynamic stress formula in predicting the stress states in the vicinity of the crack tip and other sources of stress concentration. The peridynamic stress is evaluated within the bond-based peridynamics with prototype microelastic brittle (PMB) material model. It is found that the PMB material model may exhibit nonlinear constitutive behaviors at large deformations. The stress fields calculated through the proposed peridynamic stress formula show good agreements with finite element analysis results, analytical solutions, and experimental data, demonstrating the promising potential of derived peridynamic stress formula in simulating the stress states of problems with discontinuities, especially in the bond-based peridynamics.

preprint2020arXiv

An Artificial-intelligence/Statistics Solution to Quantify Material Distortion for Thermal Compensation in Additive Manufacturing

In this paper, we introduce a probabilistic statistics solution or artificial intelligence (AI) approach to identify and quantify permanent (non-zero strain) continuum/material deformation only based on the scanned material data in the spatial configuration and the shape of the initial design configuration or the material configuration. The challenge of this problem is that we only know the scanned material data in the spatial configuration and the shape of the design configuration of three-dimensional (3D) printed products, whereas for a specific scanned material point we do not know its corresponding material coordinates in the initial or designed referential configuration, provided that we do not know the detailed information on actual physical deformation process. Different from physics-based modeling, the method developed here is a data-driven artificial intelligence method, which solves the problem with incomplete deformation data or with missing information of actual physical deformation process. We coined the method is an AI-based material deformation finding algorithm. This method has practical significance and important applications in finding and designing thermal compensation configuration of a 3D printed product in additive manufacturing, which is at the heart of the cutting edge 3D printing technology. In this paper, we demonstrate that the proposed AI continuum/material deformation finding approach can accurately find permanent thermal deformation configuration for a complex 3D printed structure component, and hence to identify the thermal compensation design configuration in order to minimizing the impact of temperature fluctuations on 3D printed structure components that are sensitive to changes of temperature.

preprint2014arXiv

A Concurrent Multiscale Micromorphic Molecular Dynamics. Part I. Theoretical Formulation

Based on a novel concept of multiplicative multiscale decomposition, we have derived a multiscale micromorphic molecular dynamics (MMMD)to extent the (Andersen)-Parrinello-Rahman molecular dynamics to mesoscale and macroscale. The multiscale micromorphic molecular dynamics is a con-current three-scale particle dynamics that couples a fine scale molecular dynamics, a mesoscale particle dynamics of micromorphic medium, and a coarse scale nonlocal particle dynamics of nonlinear continuum. By choosing proper statistical closure conditions, we have shown that the original Andersen-Parrinello-Rahman molecular dynamics can be rigorously formulated and justified from first principle, and it is a special case of the proposed multiscale micromorphic molecular dynamics. The discovered mutiscale structure and the corresponding multiscale dynamics reveal a seamless transition channel from atomistic scale to continuum scale and the intrinsic coupling relation among them, and it can be used to solve finite size nanoscale science and engineering problems with arbitrary boundary conditions.