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Sanjay Nayak

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cond-mat.mtrl-sci physics.app-ph

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preprint2025arXiv

Wafer-Scale Integration of Piezo- and Ferroelectric Al0.64Sc0.36N Thin Films by Reactive Sputtering

Large-area deposition of Aluminium-Scandium-Nitride (Al1-xScxN) thin films with higher Sc content (x) remains challenging due to issues such as abnormal orientation growth, stress control, and the undesired crystal phase. These anomalies across the wafer hinder the development of high scandium-content AlScN films, which are critical for microelectromechanical systems applications. In this study, we report the sputter deposition of Al0.64Sc0.36N thin films from a 300 mm Al0.64Sc0.36 alloy target on 200 mm Si(100) wafers, achieving an exceptionally high deposition rate of 8.7 μm/h with less than 1% AOGs and controllable stress tuning. Comprehensive microstructural and electrical characterizations confirm the superior growth of high-quality Al0.64Sc0.36N films with exceptional wafer-average piezoelectric coefficients (d33,f =15.62 pm/V and e31,f = -2.9 C/m2) owing to low point defects density and grain mosaicity. This was accomplished through the implementation of an optimized seed layer and a refined electrode integration strategy, along with optimal process conditions. The wafer yield and device failure rates are analysed and correlated with the average stress of the films and their stress profiles along the diameter. The resulting films show excellent uniformity in structural, compositional, and piezoelectric properties across the entire 200 mm wafer, underscoring their strong potential for next-generation MEMS applications.

preprint2023arXiv

In-situ real-time evolution of intrinsic stresses and microstructure during growth of cathodic arc deposited (Al,Ti)N coatings

The residual stress plays a vital role in determination of the device performance that uses thin films coating and thus the accurate determination of stress and its optimization with process parameters is an ongoing research work for many decades. In line with this, the microscopic origin of the stress at the atomic scale and its development during the thin film deposition is a matter of major scientific interests. The development of stress is a complex phenomenon and has a complex dependence to process parameters, film microstructure and its morphology. In this work, by utilizing a custom-designed cathodic arc deposition system and synchrotron radiation based 2D x-ray diffraction (XRD) technique, we determine the real-time evolution of stress, crystallite sizes and their preferential orientations of Aluminum-Titanium-Nitride (AlxTi1-xN) films with varied Al-content (x=0.0, 0.25, 0.50, and 0.67) on Si-100 substrate. The energies of incoming ions and hence stress in the films is tuned by applying different direct current substrate bias (Vs = floating potential, -20, -40, -60, -80, and -100 V). The instantaneous stress is evaluated by the well-known d vs. sin2ψ technique, while crystallite sizes are determined by analyzing line profiles of x-ray diffractograms. The evolution of stress and crystallite sizes are modelled with multiple numerical models from which kinetic parameters associated with the thin film depositions are extracted. The ex-situ microstructure characterizations of AlxTi1-xN coatings are carried out by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The formation of ex-situ microstructure of the films is discussed considering the results obtained from in-situ XRD data. Finally, we demonstrate that the method utilized here is a powerful approach towards estimation of the fracture toughness of thin film coatings.

preprint2019arXiv

Gallium-Boron-Phosphide (GaBP$_2$): A New III-V Semiconductor for photovoltaics

Using machine learning (ML) approach, we unearthed a new III-V semiconducting material having an optimal bandgap for high efficient photovoltaics with the chemical composition of Gallium-Boron-Phosphide(GaBP$_2$, space group: Pna2$_1$). ML predictions are further validated by state of the art ab-initio density functional theory (DFT) simulations. The stoichiometric Heyd-Scuseria-Ernzerhof (HSE) bandgap of GaBP$_2$ is noted to 1.65 eV, a close ideal value (1.4-1.5 eV) to reach the theoretical Queisser-Shockley limit. The calculated electron mobility is similar to that of silicon. Unlike perovskites, the newly discovered material is thermally, dynamically and mechanically stable. Above all the chemical composition of GaBP$_2$ are non-toxic and relatively earth-abundant, making it a new generation of PV material. Using ML, we show that with a minimal set of features the bandgap of III-III-V and II-IV-V semiconductor can be predicted up to an RMSE of less than 0.4 eV. We presented a set of scaling laws, which can be used to estimate the bandgap of new III-III-V and II-IV-V semiconductor, with three different crystal phases, within an RMSE of approx. 0.5 eV.