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Nuria Llombart

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Published work

3 published item(s)

preprint2020arXiv

DESHIMA on ASTE: On-sky Responsivity Calibration of the Integrated Superconducting Spectrometer

We are developing an ultra-wideband spectroscopic instrument, DESHIMA (DEep Spectroscopic HIgh-redshift MApper), based on the technologies of an on-chip filter-bank and Microwave Kinetic Inductance Detector (MKID) to investigate dusty star-burst galaxies in the distant universe at millimeter and submillimeter wavelength. An on-site experiment of DESHIMA was performed using the ASTE 10-m telescope. We established a responsivity model that converts frequency responses of the MKIDs to line-of-sight brightness temperature. We estimated two parameters of the responsivity model using a set of skydip data taken under various precipitable water vapor (PWV, 0.4-3.0 mm) conditions for each MKID. The line-of-sight brightness temperature of sky is estimated using an atmospheric transmission model and the PWVs. As a result, we obtain an average temperature calibration uncertainty of $1σ=4$%, which is smaller than other photometric biases. In addition, the average forward efficiency of 0.88 in our responsivity model is consistent with the value expected from the geometrical support structure of the telescope. We also estimate line-of-sight PWVs of each skydip observation using the frequency response of MKIDs, and confirm the consistency with PWVs reported by the Atacama Large Millimeter/submillimeter Array.

preprint2012arXiv

MKID development for SuperSpec: an on-chip, mm-wave, filter-bank spectrometer

SuperSpec is an ultra-compact spectrometer-on-a-chip for millimeter and submillimeter wavelength astronomy. Its very small size, wide spectral bandwidth, and highly multiplexed readout will enable construction of powerful multibeam spectrometers for high-redshift observations. The spectrometer consists of a horn-coupled microstrip feedline, a bank of narrow-band superconducting resonator filters that provide spectral selectivity, and Kinetic Inductance Detectors (KIDs) that detect the power admitted by each filter resonator. The design is realized using thin-film lithographic structures on a silicon wafer. The mm-wave microstrip feedline and spectral filters of the first prototype are designed to operate in the band from 195-310 GHz and are fabricated from niobium with at Tc of 9.2K. The KIDs are designed to operate at hundreds of MHz and are fabricated from titanium nitride with a Tc of 2K. Radiation incident on the horn travels along the mm-wave microstrip, passes through the frequency-selective filter, and is finally absorbed by the corresponding KID where it causes a measurable shift in the resonant frequency. In this proceedings, we present the design of the KIDs employed in SuperSpec and the results of initial laboratory testing of a prototype device. We will also briefly describe the ongoing development of a demonstration instrument that will consist of two 500-channel, R=700 spectrometers, one operating in the 1-mm atmospheric window and the other covering the 650 and 850 micron bands.

preprint2012arXiv

SuperSpec: design concept and circuit simulations

SuperSpec is a pathfinder for future lithographic spectrometer cameras, which promise to energize extra-galactic astrophysics at (sub)millimeter wavelengths: delivering 200--500 km/s spectral velocity resolution over an octave bandwidth for every pixel in a telescope's field of view. We present circuit simulations that prove the concept, which enables complete millimeter-band spectrometer devices in just a few square-millimeter footprint. We evaluate both single-stage and two-stage channelizing filter designs, which separate channels into an array of broad-band detectors, such as bolometers or kinetic inductance detector (KID) devices. We discuss to what degree losses (by radiation or by absorption in the dielectric) and fabrication tolerances affect the resolution or performance of such devices, and what steps we can take to mitigate the degradation. Such design studies help us formulate critical requirements on the materials and fabrication process, and help understand what practical limits currently exist to the capabilities these devices can deliver today or over the next few years.