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Mark D. Hill

Mark D. Hill appears in the imported research catalog. Authorship, coauthor and topic links are available while profile ownership is still unclaimed.

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cs.CYHardware ArchitectureDatabases

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Published work

5 published item(s)

preprint2021arXiv

Advancing Computing's Foundation of US Industry & Society

While past information technology (IT) advances have transformed society, future advances hold even greater promise. For example, we have only just begun to reap the changes from artificial intelligence (AI), especially machine learning (ML). Underlying IT's impact are the dramatic improvements in computer hardware, which deliver performance that unlock new capabilities. For example, recent successes in AI/ML required the synergy of improved algorithms and hardware architectures (e.g., general-purpose graphics processing units). However, unlike in the 20th Century and early 2000s, tomorrow's performance aspirations must be achieved without continued semiconductor scaling formerly provided by Moore's Law and Dennard Scaling. How will one deliver the next 100x improvement in capability at similar or less cost to enable great value? Can we make the next AI leap without 100x better hardware? This whitepaper argues for a multipronged effort to develop new computing approaches beyond Moore's Law to advance the foundation that computing provides to US industry, education, medicine, science, and government. This impact extends far beyond the IT industry itself, as IT is now central for providing value across society, for example in semi-autonomous vehicles, tele-education, health wearables, viral analysis, and efficient administration. Herein we draw upon considerable visioning work by CRA's Computing Community Consortium (CCC) and the IEEE Rebooting Computing Initiative (IEEE RCI), enabled by thought leader input from industry, academia, and the US government.

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preprint2020arXiv

Opportunities and Challenges for Next Generation Computing

Computing has dramatically changed nearly every aspect of our lives, from business and agriculture to communication and entertainment. As a nation, we rely on computing in the design of systems for energy, transportation and defense; and computing fuels scientific discoveries that will improve our fundamental understanding of the world and help develop solutions to major challenges in health and the environment. Computing has changed our world, in part, because our innovations can run on computers whose performance and cost-performance has improved a million-fold over the last few decades. A driving force behind this has been a repeated doubling of the transistors per chip, dubbed Moore's Law. A concomitant enabler has been Dennard Scaling that has permitted these performance doublings at roughly constant power, but, as we will see, both trends face challenges. Consider for a moment the impact of these two trends over the past 30 years. A 1980's supercomputer (e.g. a Cray 2) was rated at nearly 2 Gflops and consumed nearly 200 KW of power. At the time, it was used for high performance and national-scale applications ranging from weather forecasting to nuclear weapons research. A computer of similar performance now fits in our pocket and consumes less than 10 watts. What would be the implications of a similar computing/power reduction over the next 30 years - that is, taking a petaflop-scale machine (e.g. the Cray XK7 which requires about 500 KW for 1 Pflop (=1015 operations/sec) performance) and repeating that process? What is possible with such a computer in your pocket? How would it change the landscape of high capacity computing? In the remainder of this paper, we articulate some opportunities and challenges for dramatic performance improvements of both personal to national scale computing, and discuss some "out of the box" possibilities for achieving computing at this scale.

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preprint2016arXiv

21st Century Computer Architecture

Because most technology and computer architecture innovations were (intentionally) invisible to higher layers, application and other software developers could reap the benefits of this progress without engaging in it. Higher performance has both made more computationally demanding applications feasible (e.g., virtual assistants, computer vision) and made less demanding applications easier to develop by enabling higher-level programming abstractions (e.g., scripting languages and reusable components). Improvements in computer system cost-effectiveness enabled value creation that could never have been imagined by the field's founders (e.g., distributed web search sufficiently inexpensive so as to be covered by advertising links). The wide benefits of computer performance growth are clear. Recently, Danowitz et al. apportioned computer performance growth roughly equally between technology and architecture, with architecture credited with ~80x improvement since 1985. As semiconductor technology approaches its "end-of-the-road" (see below), computer architecture will need to play an increasing role in enabling future ICT innovation. But instead of asking, "How can I make my chip run faster?," architects must now ask, "How can I enable the 21st century infrastructure, from sensors to clouds, adding value from performance to privacy, but without the benefit of near-perfect technology scaling?". The challenges are many, but with appropriate investment, opportunities abound. Underlying these opportunities is a common theme that future architecture innovations will require the engagement of and investments from innovators in other ICT layers.

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preprint2016arXiv

Arch2030: A Vision of Computer Architecture Research over the Next 15 Years

Application trends, device technologies and the architecture of systems drive progress in information technologies. However, the former engines of such progress - Moore's Law and Dennard Scaling - are rapidly reaching the point of diminishing returns. The time has come for the computing community to boldly confront a new challenge: how to secure a foundational future for information technology's continued progress. The computer architecture community engaged in several visioning exercises over the years. Five years ago, we released a white paper, 21st Century Computer Architecture, which influenced funding programs in both academia and industry. More recently, the IEEE Rebooting Computing Initiative explored the future of computing systems in the architecture, device, and circuit domains. This report stems from an effort to continue this dialogue, reach out to the applications and devices/circuits communities, and understand their trends and vision. We aim to identify opportunities where architecture research can bridge the gap between the application and device domains.

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preprint2016arXiv

When to use 3D Die-Stacked Memory for Bandwidth-Constrained Big Data Workloads

Response time requirements for big data processing systems are shrinking. To meet this strict response time requirement, many big data systems store all or most of their data in main memory to reduce the access latency. Main memory capacities have grown, and systems with 2 TB of main memory capacity available today. However, the rate at which processors can access this data--the memory bandwidth--has not grown at the same rate. In fact, some of these big-memory systems can access less than 10% of their main memory capacity in one second (billions of processor cycles). 3D die-stacking is one promising solution to this bandwidth problem, and industry is investing significantly in 3D die-stacking. We use a simple back-of-the-envelope-style model to characterize if and when the 3D die-stacked architecture is more cost-effective than current architectures for in-memory big data workloads. We find that die-stacking has much higher performance than current systems (up to 256x lower response times), and it does not require expensive memory over provisioning to meet real-time (10 ms) response time service-level agreements. However, the power requirements of the die-stacked systems are significantly higher (up to 50x) than current systems, and its memory capacity is lower in many cases. Even in this limited case study, we find 3D die-stacking is not a panacea. Today, die-stacking is the most cost-effective solution for strict SLAs and by reducing the power of the compute chip and increasing memory densities die-stacking can be cost-effective under other constraints in the future.

0 citations0 reviewsNo code linkedOpen access