Background Monte Carlo Samples for a Future Hadron Collider
A description of Standard Model background Monte Carlo samples produced for studies related to future hadron colliders.
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A description of Standard Model background Monte Carlo samples produced for studies related to future hadron colliders.
The perspective of designing muon colliders with high energy and luminosity, which is being investigated by the International Muon Collider Collaboration, has triggered a growing interest in their physics reach. We present a concise summary of the muon colliders potential to explore new physics, leveraging on the unique possibility of combining high available energy with very precise measurements.
Among the post-LHC generation of particle accelerators, the muon collider represents a unique machine with capability to provide very high energy leptonic collisions and to open the path to a vast and mostly unexplored physics programme. However, on the experimental side, such great physics potential is accompanied by unprecedented technological challenges, due to the fact that muons are unstable particles. Their decay products interact with the machine elements and produce an intense flux of background particles that eventually reach the detector and may degrade its performance. In this paper, we present technologies that have a potential to match the challenging specifications of a muon collider detector and outline a path forward for the future R&D efforts.
In this paper we report on the current status of studies on the expected performance for a detector designed to operate in a muon collider environment. Beam-induced backgrounds (BIB) represent the main challenge in the design of the detector and the event reconstruction algorithms. The current detector design aims to show that satisfactory performance can be achieved, while further optimizations are expected to significantly improve the overall performance. We present the characterization of the expected beam-induced background, describe the detector design and software used for detailed event simulations taking into account BIB effects. The expected performance of charged-particle reconstruction, jets, electrons, photons and muons is discussed, including an initial study on heavy-flavor jet tagging. A simple method to measure the delivered luminosity is also described. Overall, the proposed design and reconstruction algorithms can successfully reconstruct the high transverse-momentum objects needed to carry out a broad physics program.
In the path towards a muon collider with center of mass energy of 10 TeV or more, a stage at 3 TeV emerges as an appealing option. Reviewing the physics potential of such muon collider is the main purpose of this document. In order to outline the progression of the physics performances across the stages, a few sensitivity projections for higher energy are also presented. There are many opportunities for probing new physics at a 3 TeV muon collider. Some of them are in common with the extensively documented physics case of the CLIC 3 TeV energy stage, and include measuring the Higgs trilinear coupling and testing the possible composite nature of the Higgs boson and of the top quark at the 20 TeV scale. Other opportunities are unique of a 3 TeV muon collider, and stem from the fact that muons are collided rather than electrons. This is exemplified by studying the potential to explore the microscopic origin of the current $g$-2 and $B$-physics anomalies, which are both related with muons.
For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.