Researcher profile

Giuseppe C. Tettamanzi

Giuseppe C. Tettamanzi contributes to research discovery and scholarly infrastructure.

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Published work

6 published item(s)

preprint2021arXiv

Non-adiabatic quantum control of valley states in silicon

Non-adiabatic quantum effects, often experimentally observed in semiconductors nano-devices such as single-electron pumps operating at high frequencies, can result in undesirable and uncontrollable behaviour. However, when combined with the valley degree of freedom inherent to silicon, these unfavourable effects may be leveraged for quantum information processing schemes. By using an explicit time evolution of the Schrodinger equation, we study numerically non-adiabatic transitions between the two lowest valley states of an electron in a quantum dot formed in a SiGe/Si heterostructure. The presence of a single atomic layer step at the top SiGe/Si interface opens an anti-crossing in the electronic spectrum as the centre of the quantum dot is varied. We show that an electric field applied perpendicularly to the interface allows tuning of the anti-crossing energy gap. As a result, by moving the electron through this anti-crossing, and by electrically varying the energy gap, it is possible to electrically control the probabilities of the two lowest valley states.

preprint2021arXiv

Ultra-Highly Linear Magnetic Flux-to-Voltage response in Proximity-based Mesoscopic bi-SQUIDs

Superconducting double-loop interferometers (bi-SQUIDs) have been introduced to produce magnetic flux sensors specifically designed to exhibit ultra-highly linear voltage response as a function of the magnetic flux. These devices are very important for the quantum sensing and for signal processing of signals oscillating at the radio-frequencies range of the electromagnetic spectrum. Here, we report an Al double-loop bi-SQUIDs based on proximitized mesoscopic Cu Josephson junctions. Such a scheme provides an alternative fabrication approach to conventional tunnel junction-based interferometers, where the junction characteristics and, consequently, the magnetic flux-to-voltage and magnetic flux-to-critical current device response can be largely and easily tailored by the geometry of the metallic weak-links. We discuss the performance of such sensors by showing a full characterization of the device switching current and voltage drop \textit{vs.} magnetic flux for temperatures of operation ranging from 30 mK to $\sim 1$ K. The figure of merit of the transfer function and of the total harmonic distortion are also discussed. The latter provides an estimate of the linearity of the flux-to-voltage device response, which obtained values as large as 45 dB. Such a result let us foresee a performance already on pair with that achieved in conventional tunnel junction-based bi-SQUIDs arrays composed of hundreds of interferometers.

preprint2015arXiv

A planar Al-Si Schottky Barrier MOSFET operated at cryogenic temperatures

Schottky Barrier (SB)-MOSFET technology offers intriguing possibilities for cryogenic nano-scale devices, such as Si quantum devices and superconducting devices. We present experimental results on a novel device architecture where the gate electrode is self-aligned with the device channel and overlaps the source and drain electrodes. This facilitates a sub-5 nm gap between the source/drain and channel, and no spacers are required. At cryogenic temperatures, such devices function as p-MOS Tunnel FETs, as determined by the Schottky barrier at the Al-Si interface, and as a further advantage, fabrication processes are compatible with both CMOS and superconducting logic technology.

preprint2011arXiv

Interface trap density metrology from sub-threshold transport in highly scaled undoped Si n-FinFETs

Channel conductance measurements can be used as a tool to study thermally activated electron transport in the sub-threshold region of state-of-art FinFETs. Together with theoretical Tight-Binding (TB) calculations, this technique can be used to understand the evolution of source-to-channel barrier height (Eb) and of active channel area (S) with gate bias (Vgs). The quantitative difference between experimental and theoretical values that we observe can be attributed to the interface traps present in these FinFETs. Therefore, based on the difference between measured and calculated values of (i) S and (ii) |dEb/dVgs| (channel to gate coupling), two new methods of interface trap density (Dit) metrology are outlined. These two methods are shown to be very consistent and reliable, thereby opening new ways of analyzing in situ state-of-the-art multi-gate FETs down to the few nm width limit. Furthermore, theoretical investigation of the spatial current density reveal volume inversion in thinner FinFETs near the threshold voltage.

preprint2010arXiv

Flux noise in ion-implanted nanoSQUIDs

Focused ion beam (FIB) technology has been used to fabricate miniature Nb DC SQUIDs which incorporate resistively-shunted microbridge junctions and a central loop with a hole diameter ranging from 1058 nm to 50 nm. The smallest device, with a 50 nm hole diameter, has a white flux noise level of 2.6 microphy_{0}/Hz^{0.5} at 10^{4} Hz. The scaling of the flux noise properties and focusing effect of the SQUID with the hole size were examined. The observed low-frequency flux noise of different devices were compared with the contribution due to the spin fluctuation of defects during FIB processing and the thermally activated flux hopping in the SQUID washer.

preprint2010arXiv

Thermionic Emission as a tool to study transport in undoped nFinFETs

Thermally activated sub-threshold transport has been investigated in undoped triple gate MOSFETs. The evolution of the barrier height and of the active cross-section area of the channel as a function of gate voltage has been determined. The results of our experiments and of the Tight Binding simulations we have developed are both in good agreement with previous analytical calculations, confirming the validity of thermionic approach to investigate transport in FETs. This method provides an important tool for the improvement of devices characteristics.