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Researcher profile

Fulvio Mazzamuto

Fulvio Mazzamuto contributes to research discovery and scholarly infrastructure.

ResearcherAffiliation not importedOpen to collaborate
physics.app-phcond-mat.mes-hallcond-mat.mtrl-sci

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Published work

5 published item(s)

preprint2022arXiv

Failure Mode Analysis in Microsecond UV Laser Annealing of Cu Thin Films

The need of surface-localized thermal processing is strongly increasing especially w.r.t three-dimensionally (3D) integrated electrical devices. UV laser annealing (UV-LA) technology well addresses this challenge. Particularly UV-LA can reduce resistivity by enlarging metallic grains in lines or thin films, irradiating only the interconnects for short timescales. However, the risk of failure in electrical performance must be correctly managed, and that of UV-LA has not been deeply studied yet. In this work microsecond-scale UV-LA is applied on a stack comparable to an interconnect structure (dielectric/Cu/Ta/SiO2/Si) in either melt or sub-melt regime for grain growth. The failure modes such as (i) Cu diffusion into SiO2, (ii) O incorporation into Cu, and (iii) intermixing between Cu and Ta are investigated.

0 citations0 reviewsNo code linkedOpen access
preprint2022arXiv

Microsecond non-melt UV laser annealing for future 3D-stacked CMOS

Three-dimensional (3D) CMOS technology encourages the use of UV laser annealing (UV-LA) because the shallow absorption of UV light into materials and the process timescale typically from nanoseconds (ns) to microseconds (us) strongly limit the vertical heat diffusion. In this work, us UV-LA solid phase epitaxial regrowth (SPER) demonstrated an active carrier concentration surpassing 1 x 10^21 at./cm^-3 in an arsenic ion-implanted silicon-on-insulator substrate. After the subsequent ns UV-LA known for improving CMOS interconnect, only a slight (about 5%) sheet resistance increase was observed. The results open a possibility to integrate UV-LA at different stages of 3D-stacked CMOS.

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preprint2022arXiv

Solid Phase Recrystallization in Arsenic Ion-Implanted Silicon-On-Insulator by Microsecond UV Laser Annealing

UV laser annealing (UV-LA) enables surface-localized high-temperature thermal processing to form abrupt junctions in emerging monolithically stacked devices, where the applicable thermal budget is restricted. In this work, UV-LA is performed to regrow a silicon-on-insulator wafer partially amorphized by arsenic ion implantation as well as to activate the dopants. In a microsecond scale ( 10^-6 s to 10^-5 s) UV-LA process, monocrystalline solid phase recrystallization and dopant activation without junction deepening are evidenced, thus opening various applications in low thermal budget integration flows. However, some concerns remain. First, the surface morphology is degraded after the regrowth, possibly because of the non-perfect uniformity of the used laser beam and/or the formation of defects near the surface involving the excess dopants. Second, many of the dopants are inactive and seem to form deep levels in the Si band gap, suggesting a further optimization of the ion implantation condition to manage the initial crystal damage and the heating profile to better accommodate the dopants into the substitutional sites.

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preprint2021arXiv

Dopant redistribution and activation in Ga ion-implanted high Ge content SiGe by explosive crystallization during UV nanosecond pulsed laser annealing

Explosive crystallization (EC) is often observed when using nanosecond-pulsed melt laser annealing (MLA) in amorphous silicon (Si) and germanium (Ge). The solidification velocity in EC is so fast that a diffusion-less crystallization can be expected. In the contacts of advanced transistors, the active level at the metal/semiconductor Schottky interface must be very high to achieve a sub-10^{-9} ohm.cm2 contact resistivity, which has been already demonstrated by using the dopant surface segregation induced by MLA. However, the beneficial layer of a few nanometers at the surface may be easily consumed during subsequent contact cleaning and metallization. EC helps to address such kind of process integration issues, enabling the optimal positioning of the peak of the dopant chemical profile. However, there is a lack of experimental studies of EC in heavily-doped semiconductor materials. Furthermore, to the best of our knowledge, dopant activation by EC has never been experimentally reported. In this paper, we present dopant redistribution and activation by an EC process induced by UV nanosecond-pulsed MLA in heavily gallium (Ga) ion-implanted high Ge content SiGe. Based on the obtained results, we also highlight potential issues of integrating EC into real device fabrication processes and discuss how to manage them.

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preprint2012arXiv

Resonant tunneling diode based on graphene/h-BN heterostructure

In this letter, we propose the resonant tunneling diode (RTD) based on a double-barrier graphene/boron nitride (BN) heterostructure as device suitable to take advantage of the elaboration of atomic sheets containing different domains of BN and C phases within a hexagonal lattice. The device operation and performance are investigated by means of a self- consistent model within the non-equilibrium Green's function formalism on a tight-binding Hamiltonian. This RTD exhibits a negative differential conductance effect which involves the resonant tunneling through both the electron and hole bound states of the graphene quantum well. It is shown that the peak- to-valley ratio can reach the value of 4 at room temperature for gapless graphene and the value of 13 for a bandgap of 50 meV.

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