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Frederic Restagno

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Published work

2 published item(s)

preprint2016arXiv

Stress concentration in periodically rough hertzian contact: Hertz to soft-flat-punch transition

We report on the elastic contact between a spherical lens and a patterned substrate, composed of an hexagonal lattice of cylindrical pillars. The stress field and the size of the contact area are obtained by means of numerical methods (discrete Green's function superposition and iterative bisection-like methods). For small indentations, a transition from a Hertzian to a Boussinesq-Cerruti-like behavior is observed when the surface fraction of the substrate that is covered by pillars is increased. In particular, we present a master curve defined by two dimensionless parameters, which allows to predict the stress at the center of contact region in terms of the surface fraction occupied by pillars. The transition between the limiting contact regimes, Hertzian and Boussinesq-Cerruti-like, is well described by a rational function. Additionally, a simple model to describe the Boussines-Cerruti-like contact between the lens and a single elastic pillar, which takes into account the pillar geometry and the elastic properties of the two bodies, is presented.

preprint2015arXiv

Self-amplification of solid friction in interleaved assemblies

It is nearly impossible to separate two interleaved phonebooks when held by their spines. A full understanding of this astonishing demonstration of solid friction in complex assemblies has remained elusive. In this Letter, we report on experiments with controlled booklets and show that the force required increases sharply with the number of sheets. A model captures the effect of the number of sheets, their thickness and the overlapping distance. Furthermore, the data collapse onto a self-similar master curve with one dimensionless amplification parameter. In addition to solving a long-standing familiar enigma, this model system provides a framework with which one can accurately measure friction forces and coefficients at low loads, and that has relevance to complex assemblies from the macro to the nanoscale.