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Fahim Rahman

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2 published item(s)

preprint2022arXiv

Digital Twin for Secure Semiconductor Lifecycle Management: Prospects and Applications

The expansive globalization of the semiconductor supply chain has introduced numerous untrusted entities into different stages of a device's lifecycle. To make matters worse, the increase complexity in the design as well as aggressive time to market requirements of the newer generation of integrated circuits can lead either designers to unintentionally introduce security vulnerabilities or verification engineers to fail in detecting them earlier in the design lifecycle. These overlooked or undetected vulnerabilities can be exploited by malicious entities in subsequent stages of the lifecycle through an ever widening variety of hardware attacks. The ability to ascertain the provenance of these vulnerabilities, therefore, becomes a pressing issue when the security assurance across the whole lifecycle is required to be ensured. We posit that if there is a malicious or unintentional breach of security policies of a device, it will be reflected in the form of anomalies in the traditional design, verification and testing activities throughout the lifecycle. With that, a digital simulacrum of a device's lifecycle, called a digital twin (DT), can be formed by the data gathered from different stages to secure the lifecycle of the device. In this paper, we put forward a realization of intertwined relationships of security vulnerabilities with data available from the silicon lifecycle and formulate different components of an AI driven DT framework. The proposed DT framework leverages these relationships and relational learning to achieve Forward and Backward Trust Analysis functionalities enabling security aware management of the entire lifecycle. Finally, we provide potential future research avenues and challenges for realization of the digital twin framework to enable secure semiconductor lifecycle management.

preprint2022arXiv

Quantifiable Assurance: From IPs to Platforms

Hardware vulnerabilities are generally considered more difficult to fix than software ones because they are persistent after fabrication. Thus, it is crucial to assess the security and fix the vulnerabilities at earlier design phases, such as Register Transfer Level (RTL) and gate level. The focus of the existing security assessment techniques is mainly twofold. First, they check the security of Intellectual Property (IP) blocks separately. Second, they aim to assess the security against individual threats considering the threats are orthogonal. We argue that IP-level security assessment is not sufficient. Eventually, the IPs are placed in a platform, such as a system-on-chip (SoC), where each IP is surrounded by other IPs connected through glue logic and shared/private buses. Hence, we must develop a methodology to assess the platform-level security by considering both the IP-level security and the impact of the additional parameters introduced during platform integration. Another important factor to consider is that the threats are not always orthogonal. Improving security against one threat may affect the security against other threats. Hence, to build a secure platform, we must first answer the following questions: What additional parameters are introduced during the platform integration? How do we define and characterize the impact of these parameters on security? How do the mitigation techniques of one threat impact others? This paper aims to answer these important questions and proposes techniques for quantifiable assurance by quantitatively estimating and measuring the security of a platform at the pre-silicon stages. We also touch upon the term security optimization and present the challenges for future research directions.