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Dagou A. Zeze

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Published work

2 published item(s)

preprint2013arXiv

Nanoscale resolution scanning thermal microscopy with thermally conductive nanowire probes

Scanning thermal microscopy (SThM) - a type of scanning probe microscopy that allows mapping thermal transport and temperatures in nanoscale devices, is becoming a key approach that may help to resolve heat dissipation problems in modern processors and develop new thermoelectric materials. Unfortunately, performance of current SThM implementations in measurement of high thermal conductivity materials continues to me limited. The reason for these limitations is two-fold - first, SThM measurements of high thermal conductivity materials need adequate high thermal conductivity of the probe apex, and secondly, the quality of thermal contact between the probe and the sample becomes strongly affected by the nanoscale surface corrugations of the studied sample. In this paper we develop analytical models of the SThM approach that can tackle these complex problems - by exploring high thermal conductivity nanowires as a tip apex, and exploring contact resistance between the SThM probe and studied surface, the latter becoming particularly important when both tip and surface have high thermal conductivities. We develop analytical model supported by the finite element analysis simulations and by the experimental tests of SThM prototype using carbon nanotube (CNT) at the tip apex as a heat conducting nanowire. These results elucidate vital relationships between the performance of the probe in SThM from one side and thermal conductivity, geometry of the probe and its components from the other, providing pathway for overcoming current limitations of SThM.

preprint2013arXiv

Ultra High Thermal Resolution Scanning Probe Microscopy via Carbon Nanotube Tipped Thermal Probes

We present a new concept of scanning thermal nanoprobe that utilizes the extreme thermal conductance of a carbon nanotube (CNT) to channel heat between the probe and the sample. The integration of CNT in scanning thermal microscopy (SThM) overcomes the main drawbacks of standard SThM probes, where the low thermal conductance of the apex SThM probe is the main limiting factor. The integration of CNT (CNT- SThM) extends SThM sensitivity to thermal transport measurement in higher thermal conductivity materials such as metals, semiconductors and ceramics, while also improving the spatial resolution. Investigation of thermal transport in ultra large scale integration (ULSI) interconnects, using CNT- SThM probe, showed fine details of heat transport in ceramic layer, vital for mitigating electromigration in ULSI metallic current leads. For a few layer graphene, the heat transport sensitivity and spatial resolution of the CNT-SThM probe demonstrated significantly superior thermal resolution compared to that of standard SThM probes achieving 20-30 nm topography and ~30 nm thermal spatial resolution compared to 50-100 nm for standard SThM probes. The outstanding axial thermal conductivity, high aspect ratio and robustness of CNTs can make CNT-SThM the perfect thermal probe for the measurement of nanoscale thermophysical properties and an excellent candidate for the next generation of thermal microscopes.