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D. Stöffler

D. Stöffler contributes to research discovery and scholarly infrastructure.

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Published work

2 published item(s)

preprint2014arXiv

Unusual resistance-voltage dependence of nanojunctions during electromigration in ultra-high vacuum

The electrical resistance R of metallic nanocontacts subjected to controlled cyclic electromigration in ultra-high vacuum has been investigated in-situ as a function of applied voltage V. For sufficiently small contacts, i.e., large resistance, a decrease of R(V) while increasing V is observed. This effect is tentatively attributed to the presence of contacts separated by thin vacuum barriers in parallel to ohmic nanocontacts. Simple model calculations indicate that both thermal activation or tunneling can lead to this unusual behavior. We describe our data by a tunneling model whose key parameter, i.e., the tunneling distance, changes because of thermal expansion due to Joule heating and/or electrostatic strain arising from the applied voltage. Oxygen exposure during electromigration prevents the formation of negative R(V) slopes, and at the same time enhances the probability of uncontrolled melting, while other gases show little effects. In addition, indication for field emission has been observed in some samples

preprint2011arXiv

Scanning probe microscopy imaging of metallic nanocontacts

We show scanning probe microscopy measurements of metallic nanocontacts between controlled electromigration cycles. The nanowires used for the thinning process are fabricated by shadow evaporation. The highest resolution obtained using scanning force microscopy is about 3 nm. During the first few electromigration cycles the overall slit structure of the nanocontact is formed. The slit first passes along grain boundaries and then at a later stage vertically splits grains in the course of consuming them. We find that first the whole wire is heated and later during the thinning process as the slit forms the current runs over several smaller contacts which needs less power.