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Researcher profile

Christopher M. Gourlay

Christopher M. Gourlay contributes to research discovery and scholarly infrastructure.

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cond-mat.mtrl-sciphysics.app-ph

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Published work

4 published item(s)

preprint2022arXiv

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.

0 citations0 reviewsNo code linkedOpen access
preprint2022arXiv

Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from β-Sn micropillars to polycrystals with intermetallics

The mechanical properties of $β$-Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity modelling. The slip strength and rate sensitivity of several key slip systems within $β$-Sn single crystals have been determined. Consistency between the numerically predicted and experimentally observed slip traces has been shown for pillars oriented to activate single and double slip. Subsequently, the temperature-dependent, intermetallic-size-governing behaviour of a polycrystal $β$-Sn-rich alloy SAC305 (96.5Sn-3Ag-0.5Cu wt%) is predicted through a multi-scale homogenization approach, and the predicted temperature- and rate-sensitivity reproduce independent experimental results. The integrated experimental and numerical approaches provide mechanistic understanding and fundamental material properties of microstructure-sensitive behaviour of electronic solders subject to thermomechanical loading, including thermal fatigue.

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preprint2020arXiv

In-situ study of creep in Sn-3Ag-0.5Cu solder

The creep behaviour and microstructural evolution of a Sn-3Ag-0.5Cu wt.% sample with a columnar microstructure have been investigated through in-situ creep testing under constant stress of 30 MPa at 298 K. This is important, as 298 K is high temperature within the solder system and in-situ observations of microstructure evolutions confirm the mechanisms involved in deformation and ultimately failure of the material. The sample has been observed in-situ using repeat and automatic forescatter diode and auto electron backscatter diffraction imaging. During deformation, polygonisation and recrystallisation are observed heterogeneously with increasing strain, and these correlate with local lattice rotations near matrix-intermetallic compound interfaces. Recrystallised grains have either twin or special boundary relationships to their parent grains. The combination of these two imaging methods reveal one grain (loading direction, LD, 10.4 ° from [100]) deforms less than the neighbour grain 2 (LD 18.8° from [110]), with slip traces in the strain localised regions. In grain 1, (1-10)[001] slip system are observed and in grain 2, (1-10)[-1-11]/2 and (110)[-111]/2 slip systems are observed. Lattice orientation gradients build up with increasing plastic strain and near fracture recrystallisation is observed concurrent with fracture.

0 citations0 reviewsNo code linkedOpen access
preprint2020arXiv

The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures

Creep of directionally solidified Sn-3Ag-0.5Cu wt.% (SAC305) samples with near-<110> orientation along the loading direction and different microstructural lengthscale is investigated under constant load tensile testing and at a range of temperatures. The creep performance improves by refining the microstructure, i.e. the decrease in secondary dendrite arm spacing (λ2), eutectic intermetallic spacing (λe) and intermetallic compound (IMC) size, indicating as a longer creep lifetime, lower creep strain rate, change in activation energy (Q) and increase in ductility and homogeneity in macro- and micro-structural deformation of the samples. The dominating creep mechanism is obstacle-controlled dislocation creep at room temperature and transits to lattice-associated vacancy diffusion creep at elevated temperature (T/T_M > 0.7 to 0.75). The deformation mechanisms are investigated using electron backscatter diffraction (EBSD) and strain heterogeneity is identified between b/-Sn in dendrites and b/-Sn in eutectic regions containing Ag3Sn and Cu6Sn5 particles. The size of the recrystallised grains is modulated by the dendritic and eutectic spacings, however, the recrystalised grains in the eutectic regions for coarse-scaled samples (largest λ2 and λe) is only localised next to IMCs without growth in size.

0 citations0 reviewsNo code linkedOpen access