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Chengcheng Deng

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cond-mat.mes-hall cond-mat.mtrl-sci

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preprint2019arXiv

Cross interface model for the thermal transport across interface between overlapped boron nitride nanoribbons

The application of low-dimensional materials for heat dissipation requires a comprehensive understanding of the thermal transport at the cross interface, which widely exists in various composite materials and electronic devices. In this work, we proposed an analytical model, named as cross interface model (CIM), to accurately reveal the essential mechanism of the two-dimensional thermal transport at the cross interface. The applicability of CIM is validated through the comparison of the analytical results with molecular dynamics simulations for a typical cross interface of two overlapped boron nitride nanoribbons. Besides, it is figured out that the factor (η) has important influence on the thermal transport besides the thermal resistance inside and between the materials, which is found to be determined by two dimensionless parameters from its expression. Our investigations deepen the understanding of the thermal transport at the cross interface and also facilitate to guide the applications of low-dimensional materials in thermal management.

preprint2016arXiv

Enhancement of interfacial thermal conductance of SiC by overlapped carbon nanotubes and intertube atoms

We proposed a new way, adding intertube atoms, to enhance interfacial thermal conductance (ITC) between SiC-carbon nanotube (CNT) array structure. Non-equilibrium molecular dynamics method was used to study the ITC. The results show that the intertube atoms can significantly enhance the ITC. The dependence of ITC on both the temperature and the number of intertube atoms are shown. The mechanism is analyzed by calculating probability distributions of atomic forces and vibrational density of states. Our study may provide some guidance on enhancing the ITC of CNT-based composites.

preprint2016arXiv

Enhancing thermal conductivity of bulk polyethylene along two directions by paved crosswise laminate

Recently, some reports show that the ultra-low thermal conductivity of bulk polymers can be enhanced along one direction, which limits its applications. Here, we proposed paved crosswise laminate methods which can enhance the thermal conductivity of bulk polyethylene (PE) along two directions. We find that the thermal conductivity of paved crosswise polyethylene laminate (PPEL) reaches as high as 181 W/m-K along two in-plane directions, which is three orders of magnitude larger than bulk amorphous polyethylene and even more than two times larger than PE single chain (54 W/m-K). The analyses of mechanism indicated that PPEL is a much more crystal-like structure due to the inter-chain van der Waals interactions. Our study may provide guides on the design and fabrication of polymer structures with high thermal conductivity.

preprint2015arXiv

Extremely High Thermal Conductivity of Aligned Bulk Carbon Nanotube-Polyethylene Composites

The poor thermal conductivity of bulk polymers may be enhanced by combining them with high thermal conductivity materials such as carbon nanotubes. Different from random doping, we find that the aligned carbon nanotube-polyethylene composites (ACPCs) has a high thermal conductivity by non-equilibrium molecular dynamics simulations. The analyses indicate that the aligned structure can not only take advantage of the high thermal conduction of carbon nanotubes, but enhance thermal conduction of polyethylene (PE) chains. Our predictions may inspire manufacturing aligned polymer-based composites for a wide variety of applications.