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Ali Rajabpour

Ali Rajabpour contributes to research discovery and scholarly infrastructure.

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Published work

4 published item(s)

preprint2021arXiv

Enhanced local viscosity around colloidal nanoparticles probed by Equilibrium Molecular Dynamics Simulations

Nanofluids; dispersions of nanometer-sized particles in a liquid medium; have been proposed for a wide variety of thermal management applications. It is known that a solid-like nanolayer of liquid of typical thickness 0.5-1 nm surrounding the colloidal nanoparticles can act as a thermal bridge between the nanoparticle and the bulk liquid. Yet, its effect on the nanofluid viscosity has not been elucidated so far. In this article, we compute the local viscosity of the nanolayer using equilibrium molecular dynamics based on the Green-Kubo formula. We first assess the validity of the method to predict the viscosity locally. We apply this methodology to the calculation of the local viscosity in the immediate vicinity of a metallic nanoparticle for a wide range of solid-liquid interaction strength, where a nanolayer of thickness 1 nm is observed as a result of the interaction with the nanoparticle. The viscosity of the nanolayer, which is found to be higher than its corresponding bulk value, is directly dependent on the solid-liquid interaction strength. We discuss the origin of this viscosity enhancement and show that the liquid density increment alone cannot explain the values of the viscosity observed. Rather, we suggest that the solid-like structure of the distribution of the liquid atoms in the vicinity of the nanoparticle contributes to the nanolayer viscosity enhancement. Finally, we observe a failure of the Stokes-Einstein relation between viscosity and diffusion close to the wall, depending on the liquid-solid interaction strength, which we rationalize in terms of hydrodynamic slip.

preprint2021arXiv

Thermal transport in van der Waals graphene/boron-nitride structure: a molecular dynamics study

Among the van der Waals heterostructures, graphene/h-BN heterostructure is an appropriate candidate for 2D nanoelectronic devices. In this paper, using non-equilibrium molecular dynamics simulation approach, heat transport in bilayer graphene/h-BN and graphene/h-BN van der Waals heterostructure (i.e. h-BN flakes periodically inserted on the top and bottom of a graphene layer) are explored. The results show that by increasing the length of the system, the thermal conductivity of bilayer graphene/h-BN increases. Furthermore, it was revealed that heat transport in graphene/h-BN heterostructure enhances compared to that in monolayer graphene or monolayer h-BN. The size effect analysis shows that the heat fluxes passing through each layer in bilayer graphene/h-BN converges when the size of the system is larger than 100 nm. The results can improve the understanding heat transfer phenomena in the van der Waals heterostructures and improve designing of heterostructures for better thermal management and heat dissipation.

preprint2019arXiv

Thermal conductivity of graphene polymorphs and compounds: from C3N to graphdiyne lattices

Tremendous experimental and theoretical attempts to find carbon based two-dimensional semiconductors have yielded a wide variety of graphene polymorphs, such as carbon-nitride, carbonboride, graphyne and graphdiyne 2D materials with highly attractive physical and chemical properties. In this study, by conducting extensive non-equilibrium molecular dynamics simulations, we have calculated and compared the thermal conductivity of thirteen prominent carbon-based structures at different lengths and two main chirality directions. Acquired results show that the structures of C3N, C3B and C2N exhibit the highest thermal conductivity, respectively, which suggest them as suitable candidates for thermal management systems in order to enhance the heat dissipation rates. In contrast, generally graphdiyne lattices and in particular 18-6-Gdy graphdiyne yields the lowest thermal conductivity, which can be a promising feature for thermoelectric applications. As a remarkable finding, we could establish connections between the thermal conductivity and density or Young's modulus of carbon based 2D systems, which can be employed to estimate the thermal conductivity of other polymorphs. Those results can provide a comprehensive viewpoint on the thermal transport properties of the nonporous and exceedingly porous carbon based 2D materials and may be used as useful guides for future designs in thermal management.

preprint2019arXiv

Thermal rectification and interface thermal resistance in hybrid pillared-graphene and graphene: A molecular dynamics approach

In this study, we investigate the thermal rectification and thermal resistance in the hybrid pillared-graphene and graphene (PGG) system. This is done through the classical molecular dynamics simulation (MD) and also with a continuum model. At first, the thermal conductivity of both pillared-graphene and graphene is calculated employing MD simulation and Fourier low. Our results show that the thermal conductivity of the pillared-graphene is much smaller than the graphene by an order of magnitude. Next, by applying positive and negative temperature gradients along the longitudinal direction of PGG, the thermal rectification is examined. The MD results indicate that for the lengths in the range of 36 to 86nm, the thermal rectification remains almost constant (~3-5%). We have also studied the phonon density of states (DOS) on both sides of the interface of PGG. The DOS curves show that there is phonon scattering at low frequencies (acoustic mode) that depends on the imposed temperature gradient direction in the system. Therefore, we can introduce the PGG as a promising thermal rectifier at room temperature. Furthermore, in the following of this work, we also explore the temperature distribution over the PGG by using the continuum model. The results that obtained from the continuum model predict the MD results such as the temperature distribution in the upper half layer and lower full layer graphene, the temperature gap and also the thermal resistance at the interface.