Researcher profile

Alain Cochard

Alain Cochard contributes to research discovery and scholarly infrastructure.

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Published work

2 published item(s)

preprint2021arXiv

Thermal dissipation as both the strength and weakness of matter. A material failure prediction by monitoring creep

In any domain involving some stressed solids, that is, from seismology to general engineering, the strength of matter is a paramount feature to understand. We here discuss the ability of a simple thermally activated sub-critical model, that includes the auto-induced thermal evolution of cracks tips, to predict the catastrophic failure of a vast range of materials. It is in particular shown that the intrinsic surface energy barrier, for breaking the atomic bonds of many solids, can be easily deduced from the slow creeping dynamics of a crack. This intrinsic barrier is however higher than the macroscopic load threshold at which brittle matter brutally fails, possibly as a result of thermal activation and of a thermal weakening mechanism. We propose a novel method to compute the macroscopic critical energy release rate of rupture, G_a, solely from monitoring slow creep, and show that this reproduces the experimental values within 50% accuracy over twenty different materials, and over more than four decades of fracture energy.

preprint2020arXiv

Thermal weakening of cracks and brittle-ductile transition: a phase model

We present a model for the thermally activated propagation of cracks in elastic matrices. The propagation is considered as a subcritical phenomenon, the kinetics of which being described by an Arrhenius law. In this law, we take the thermal evolution of the crack front into account, assuming that a portion of the released mechanical energy is transformed into heat in a plastic process zone. We show that such a model leads to a two-phase crack propagation: a first phase at low velocity in which the temperature elevation is of little effect and the propagation is mainly governed by the mechanical load and by the toughness of the medium, and a second phase in which the crack is thermally weakened and propagates at greater velocity. Such a dual behavior can potentially explain the usual stick-slip in brittle fracturing, and we illustrate how with numerical simulations of mode I cracks propagating in thin disordered media. In addition, we predict the existence of a limiting ambient temperature above which the weakened phase ceases to exist and we propose this critical phenomenon as a novel explanation for the brittle-ductile transition of solids.