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Ajit K. Roy

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cond-mat.mtrl-sci physics.app-ph cond-mat.mes-hall

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preprint2020arXiv

Liquid-phase reinforced Metal matrix (LMM) composite with non-intuitive properties

Over the ages, efforts have been made to use composite design to reinforce metals and alloys in order to increase their strength and modulus. On the other hand, nature herself improves the strength, ductility, stiffness and toughness of materials by strengthening them with liquids having zero strength/modulus. Here, emulating nature, efforts have been made to develop a new class of tin based alloy/composite with liquid metal reinforcement (LMM). Based on thermodynamic calculations, a composition has been designed such that on melting and casting it forms a solid metal (tin solid solution) and the eutectic mixture remains in liquid form at room temperature. The composite structure named as LMM shows multifold improvement in hardness, strength, ductility, toughness and wear resistance as compared to conventional solder alloys. A Finite Element Method (FEM) based simulation shows strain distribution in the composite which results in the unique behavior. The LMM also shows a negative coefficient of thermal expansion which is further verified using in-situ microscopy and thermodynamic calculations.

preprint2020arXiv

Zeolite-inspired 3d printed structures with enhanced mechanical properties

Specific strength (strength/density) is a crucial factor while designing high load bearing architecture in areas of aerospace and defence. Strength of the material can be enhanced by blending with high strength component or, by compositing with high strength fillers but both the options has limitations such as at certain load, materials fail due to poor filler and matrix interactions. Therefore, researchers are interested in enhancing strength of materials by playing with topology/geometry and therefore nature is best option to mimic for structures whereas, complexity limits nature mimicked structures. In this paper, we have explored Zeolite-inspired structures for load bearing capacity. Zeolite-inspired structure were obtained from molecular dynamics simulation and then fabricated via Fused deposition Modeling. The atomic scale complex topology from simulation is experimentally synthesized using 3D printing. Compressibility of as-fabricated structures was tested in different direction and compared with simulation results. Such complex architecture can be used for ultralight aerospace and automotive parts.

preprint2016arXiv

Hydrogenation of Penta-Graphene Leads to Unexpected Large Improvement in Thermal Conductivity

Penta-graphene (PG) has been identified as a novel 2D material with an intrinsic bandgap, which makes it especially promising for electronics applications. In this work, we use first-principles lattice dynamics and iterative solution of the phonon Boltzmann transport equation (BTE) to determine the thermal conductivity of PG and its more stable derivative - hydrogenated penta-graphene (HPG). As a comparison, we also studied the effect of hydrogenation on graphene thermal conductivity. In contrast to hydrogenation of graphene, which leads to a dramatic decrease in thermal conductivity (from 3590 to 1328 W/mK - a 63% reduction), HPG shows a notable increase in thermal conductivity (615 W/mK), which is 76% higher than that of PG (350 W/mK). The high thermal conductivity of HPG makes it more thermally conductive than most other semi-conducting 2D materials, such as the transition metal chalcogenides. Our detailed analyses show that the primary reason for the counter-intuitive hydrogenation-induced thermal conductivity enhancement is the weaker bond anharmonicity in HPG than PG. This leads to weaker phonon scattering after hydrogenation, despite the increase in the phonon scattering phase space. The high thermal conductivity of HPG may inspire intensive research around HPG and other derivatives of PG as potential materials for future nanoelectronic devices. The fundamental physics understood from this study may open up a new strategy to engineer thermal transport properties of other 2D materials by controlling bond anharmonicity via functionalization.

preprint2013arXiv

Thermal properties of graphene: Fundamentals and applications

Graphene is a two-dimensional (2D) material with over 100-fold anisotropy of heat flow between the in-plane and out-of-plane directions. High in-plane thermal conductivity is due to covalent sp2 bonding between carbon atoms, whereas out-of-plane heat flow is limited by weak van der Waals coupling. Herein, we review the thermal properties of graphene, including its specific heat and thermal conductivity (from diffusive to ballistic limits) and the influence of substrates, defects, and other atomic modifications. We also highlight practical applications in which the thermal properties of graphene play a role. For instance, graphene transistors and interconnects benefit from the high in-plane thermal conductivity, up to a certain channel length. However, weak thermal coupling with substrates implies that interfaces and contacts remain significant dissipation bottlenecks. Heat flow in graphene or graphene composites could also be tunable through a variety of means, including phonon scattering by substrates, edges or interfaces. Ultimately, the unusual thermal properties of graphene stem from its 2D nature, forming a rich playground for new discoveries of heat flow physics and potentially leading to novel thermal management applications.